A single-chip UHF RFID reader transceiver IC has been implemented in 0.18 μm SiGe BiCMOS technology. The chip includes all transceiver blocks as RX/TX RF front-end, RX/TX analog baseband, frequency ...
As semiconductor devices continue to evolve, the demand for die bonder equipment has surged, driven by factors such as the rise of Internet of Things (IoT) enabled products, increasing reliance on ...