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中時新聞網
6d
《半导体》钰创WLCSP微封装技术 打入国际车厂供应链
钰创(5351)积极布局AI Edge应用及异质整合,今日宣布,全球首创的WLCSP微型封装技术RPC DRAM,已通过AEC-Q100 Grade-2 车规级可靠度测试标准,并成功打入国际领导品牌车厂的供应链。针对生成式AI边缘端应用,RPC D ...
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